‘HetNet’s Race to Connect’ Features More Than 15 Sponsors, 19 Industry Speakers and 24 Exhibitors
MAMARONECK, NY – March 18, 2014 – The Northeast DAS & Small Cell Association (NEDAS), a leading group of Northeast DAS and small cell professionals and end-users, unveils its agenda for the NYC In-Building Wireless Summit, taking place April 1, 2014 at Convene Midtown East located at 730 Third Avenue in New York City.
The 2014 NYC In-Building Wireless Summit assembles more than 19 highly respected industry thought-leaders to deliver on an assortment of topics pertaining to ‘HetNet’s Race to Connect’, including: 5G and beyond; how carrier coordination works; small cell and DAS implementation case studies including roof infrastructure, backhaul issues and microcell solutions; and network management. The event will also feature a number of Lightning Talks outlining key considerations for deploying in-building wireless solutions, ‘Hospital Pioneers – the Convergence of WLAN, GPON and Optical DAS’ as well as ‘Stadium Solutions – Wiring Up for the Super Bowl’.
Featured speakers include: Ezra Hug, Commercial Real Estate, AT&T; Tom Chamberlain, NE Sales Manager, ADRF; Aaron Blazar, VP of Atlantic ACM; Neil Manning, VP, Corning; Doug Wiest, EVP of Wireless Services, EdgeConneX; Joe Mullin, CTO, InSite; Art Meierdirk, Sr. Director of Business Services, INOC; James Zik, Product Director, PCTEL; Jeffery Moerdler, Partner, Mintz & Levin; Simon Saunders, Independent Wireless Expert at Real Wireless; Dennis Rigney, VP Sales, SOLiD; Greg Najjar, Director of Network Engineering, Sprint; Douglas Fishman, Director of DAS Design & Implementation, SQUAN; Ed Donelan, President, Telecom Wiring; Roger Kim, Director of Carrier Solutions, Time Warner Cable Business Class; and Jeff Thompson, CEO, Towerstream.
In addition to the speakers, event sponsors include: Black Box Network Services, Cellular Specialties, Connectivity Wireless, Dewberry, Fullerton Engineering, Galtronics, iMiller Public Relations, Launch 3 Telecom, MECA Electronics, PCTel, Primus Electronics, Snyder and Snyder, SQUAN, Towerstream, Talley, Walker and Associates and OPTEC Communications.
Exhibiting companies include: ADRF, Anritsu, ATEC Wireless, Black Box Network Services, BTI Wireless, Cellular Specialties, Connectivity Wireless Solutions, CSQUARED, Galtronics, iMiller Public Relations, INOC, Laird Technologies, Radio Frequency Systems, RCC, RF Industries, Signal Inside, SOLiD, Superior Essex, TE Connectivity, Tectonic Engineering, TESSCO, Times Microwave Systems, and more.
New for the NYC In-Building Wireless Summit are two breakout training sessions. At 10:45 AM, TESSCO is offering a training program on ‘Small Cell Deployments: What You Need to Know’; at 2:15 PM, Anritsu’s program will focus on ‘Testing Today’s DAS Networks to Meet Customer Expectations and Prepare for Tomorrow’s Demands’.
Registration for the conference is still open; free passes are available for end-users. Limited sponsorships are still available. Contact info@nedas.com to learn more.
For information about the Northeast DAS & Small Cell Association, please visit www.nedas.com or email info@nedas.com.
About Northeast DAS + Small Cell Association
Northeast DAS + Small Cell Association (NEDAS) is a grassroots wireless telecom association whose mission is to create a positive, nonpartisan and invigorating environment in which local industry professionals can learn, discuss, debate, socialize, collaborate with their peers, and encourage networking, public outreach and education about the DAS + Small Cell industry. 2014 Platinum Sponsors include Anritsu, EdgeConneX, INOC, Metro Network Services, SOLiD and TESSCO; Annual Gold Circle Sponsors are ADRF Technologies, ATEC Wireless, TE Connectivity and RF Industries; Silver Circle Sponsors are Corning Optical Communications Wireless, Inc. and Crown Castle. For more information, visit www.nedas.com.
Media Contact:
Northeast DAS + Small Cell Association
Jennifer Handshew, EVP Media Relations
Tel: +1.866.307.2510
Email: NEDAS@imillerpr.com
